Material Grade: 2N5，3N, 4N.

Shape: Disc

Dia：1"（φ25.4）、2"（φ50.8）、3"（φ76.2）、4"（φ101.6）、6"（φ152.4）、8"（φ203.2）mm or customized.

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Product Detail1

Shanghai Metal Corporation is a leading Chromium Sputtering Target manufacturer and supplier.

Chromium sputtering target is a solid metallic chromium component manufactured for physical vapor deposition (PVD) magnetron sputtering processes. It is supplied in planar disc, rectangular plate or rotary tubular geometries with defined purity grades ranging from 99.95% to 99.99%, consolidated mainly by hot isostatic pressing to achieve high relative density and controlled grain structure. This target material releases chromium atoms under plasma bombardment to deposit thin chromium‑based films onto substrate surfaces. It is widely applied for adhesion promotion layer in low‑E glass, flat‑panel display and optical coating systems, diffusion barrier layer for micro‑electronics, functional layer for decorative PVD finishing, and reaction‑spun CrN hard coating for cutting tools and mechanical components. It addresses practical technical challenges including insufficient interfacial bonding between dissimilar thin‑film stacks, copper ion diffusion toward silicon‑based substrates, low wear‑resistance of component surfaces, and unstable film thickness uniformity caused by porous target microstructure. Consistent impurity control especially for oxygen, nitrogen and carbon minimizes resistivity drift, arcing risk and particle generation during continuous sputtering production, enabling stable long‑run PVD manufacturing for glass, semiconductor, tooling and 3‑C industries.

If you want to know more about our Metal product or Chromium Sputtering Target, please feel free to contact us, we will reply you within 24 hours.

1.Material Grade: 2N5，3N, 4N.

2.Dia: 1"（φ25.4）、2"（φ50.8）、3"（φ76.2）、4"（φ101.6）、6"（φ152.4）、8"（φ203.2）mm or customized.

3.Grain Size: ≤100‑150 μm；High end requirements for fine crystals＜50 μm.

4.Melting point: 1857 ℃.

5.Mohs hardness: 9 (hard and brittle, difficult to process).

1.High density and low porosity: HIP process has a relative density of ≥ 99.6% -99.8% and pores<0.4%; Inhibit sputtering ignition and arc discharge, with fewer particles.

2.Strong substrate adhesion: It has excellent adhesion ability to glass, silicon wafers, metals, and plastics, and is a classic adhesion layer in the industry.

3.High hardness, wear and corrosion resistance: Pure Cr film has high hardness; Reactive sputtering generates CrN, HV 1800-2400, wear-resistant and corrosion-resistant.

4.Low temperature film-forming: Qualified films can be deposited at ≤ 150 ℃, compatible with thermal sensitive plastic substrates such as PC and PET.

5.Good electrical and photolithography etching performance: moderate resistivity, suitable for thin film resistance; Good etching selectivity for photolithography process, suitable for photomask pattern processing.

1.Refrigerator & Freezer Door Sealing: Ideal for fridge and freezer door gaps. Wide temperature resistance and reliable sealing retain cold air and save energy.

2.Automotive Weather-stripping: For car door, window and trunk gaps. Flexible gap filling blocks wind, rain and noise to enhance ride comfort.

3.Industrial Pipe & Tank Gaskets: Seals joints of industrial pipes and tanks. Good oil resistance prevents gas/liquid leakage for long-term reliable operation.

4.Food-grade Kitchenware & Container Seals: For kitchenware and food storage containers. Soft resilient sealing preserves food freshness and stops liquid spillage.

5.Building Door & Window Seals: Perimeter sealing for building doors and windows. High flexibility provides sound and dust insulation for indoor protection.

Chromium Sputtering Target — Purity Grade, Key Properties & Typical Applications：
Purity Grade	Main Controllable Impurities	Key Performance Features	Typical Applications
99.9% (3N)	Fe, Si, O, N, C	Generallevel impurity control; O ≤800 ppm; stable DC sputtering; moderate particle output	Decorative PVD coating, generalpurpose tool coating, lowcost R&D trials
99.95% (3N5)	Fe, Si, O, N, C	O ≤500 ppm; high density; consistent grain structure; low arcing; good film uniformity	LowE glass, flatpanel display, CIGS photovoltaic devices, general optical coatings
99.99% (4N)	Trace metal elements, O, N, C	O ≤300 ppm; ultralow tracemetal impurities; finegrain microstructure; minimum particle generation	Semiconductor diffusion barrier, photomask chromium layer, highprecision optical components
Note: All above grades are mainly produced by HIP powder metallurgy. Actual oxygen content depends on raw powder and manufacturing process.

Packaging of Chromium Sputtering Target

Standard Packaging:

The surface of the target material is coated with anti-static PE protective film (with a focus on protecting the sputtering working surface and welding edges); Put it into a high barrier aluminum-plastic composite vacuum bag and add desiccant; High vacuum sealing; And then put the finished vacuum bag into the customized EPE pearl cotton/PU foam; Outer export wooden box (sea freight).

Shipping:

We support FCL and LCL sea freight, air freight, and express delivery, depending on order quantity and destination. Available trade terms include EXW, FOB, CIF, and others upon request. Shipping costs are calculated based on cargo volume, gross weight, destination, and selected transportation method.

Lead Time：

Sample: 10 working days

Standard orders:20~30 working days

Custom orders :35 ~40 working days

Q1.What forms and sizes can you supply for chromium sputtering targets?

A: Planar disc, rectangular plate and rotary tubular types are available. Custom dimensions are acceptable according to customer drawings.

Q2.What is the lead‑time for chromium sputtering target orders?

A: Standard lead‑time is 3‑4 weeks for regular specifications. Custom‑made items require 5‑7 weeks.

Q3.Do you provide material test reports for each shipment??

A: Yes. Each batch comes with MTR covering purity, impurity content, density and dimensional inspection data

Q4.What oxygen level can be achieved for HIP‑processed Cr targets for low‑E glass production?

A: Typical oxygen content is below 500 ppm for HIP chromium targets, suitable for continuous large‑area low‑E glass sputtering lines

Q5.What bonding option is recommended for semiconductor grade Cr targets under high‑power DC sputtering?

A: Vacuum brazed copper backplate is recommended. Indium bonding is not preferred for long‑term high‑power semiconductor sputtering. C‑scan bonding inspection report can be provided.

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Chromium Sputtering Target

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